ChipMOS TECHNOLOGIES INC
IMOS Real Time Price USDRecent trades of IMOS by members of U.S. Congress
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Recently reported changes by institutional investors
Quarterly net insider trading by IMOS's directors and management
* Insider trading data parsed from SEC Form 4 filings by Quiver Quantitative. Sign up for the Quiver API for real-time access.
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About
Key Metrics
Return (1d)
Return (30d)
Return (1Y)
CAGR (Total)
Max Drawdown
Beta
Alpha
Sharpe Ratio
Win Rate
Average Win
Average Loss
Annual Volatility
Annual Std Dev
Information Ratio
Treynor Ratio
Total Trades
Metrics Definitions
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Alpha
Measures a portfolio's risk-adjusted performance against that of its benchmark
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Annual Standard Deviation
Measures how much the portfolio's total return varies from its mean or average.
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Annual Volatility
A statistical measure of the dispersion of returns for the portfolio.
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Average Win
The average return (%) for trades that resulted in a positive return.
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Average Loss
The average return (%) for trades that resulted in a negative return.
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Beta
A measure of the volatility of the portfolio compared to the market as a whole.
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CAGR
CAGR (Compounded Annual Growth Rate), is the historical annualized rate of return for an investment strategy, throughout the backtest period.
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Information Ratio
A measurement of portfolio returns beyond the returns of its benchmark compared to the volatility of those returns.
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Max Drawdown
the maximum observed loss from a peak to a trough of a portfolio, before a new peak is attained.
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Sharpe Ratio
The Sharpe Ratio is a measure of historical risk-adjusted return, which quantifies the amount of return that an investor received per unit of risk.
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Total Trades
The total number of trades made by this strategy.
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Treynor Ratio
Attempts to measure how successful an investment is in providing compensation to investors for taking on investment risk.
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Win Rate
The percentage of total trades that resulted in a positive return.
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Government lobbying spending instances
Estimated quarterly lobbying spending
IMOS Revenue by Segment or Geography
New patents grants
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Patent Title: Chip-on-film package structure Feb. 19, 2019
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Patent Title: Semiconductor device Sep. 04, 2018
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Patent Title: Multi-chip package structure manufacturing process and wafer level chip package structure manufacturing process Jun. 19, 2018
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Patent Title: Manufacturing process of wafer level chip package structure having block structure Apr. 24, 2018
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Patent Title: Semicondcutor light-emitting device and fabricating method thereof Jan. 09, 2018
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Patent Title: Re-distribution layer structure and manufacturing method thereof Jan. 02, 2018
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Patent Title: Fingerprint sensor chip package structure and manufacturing method thereof Dec. 19, 2017
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Patent Title: Insulating protrusion in the trench of a re-distribution layer structure Oct. 17, 2017
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Patent Title: Solder ball, manufacturing method thereof, and semiconductor device Oct. 03, 2017
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Patent Title: Semiconductor package Aug. 15, 2017
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Patent Title: Manufacturing method of chip package structure Aug. 15, 2017
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Patent Title: Multi-chip package structure, wafer level chip package structure and manufacturing process thereof Aug. 08, 2017
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Patent Title: Semiconductor package and method of manufacturing thereof Aug. 01, 2017
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Patent Title: Multi-chip package structure having blocking structure, wafer level chip package structure having blocking structure and manufacturing process thereof May. 16, 2017
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Patent Title: Chip package structure and method of manufacturing the same Apr. 11, 2017
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Patent Title: Semiconductor structure and method of manufacturing the same Feb. 21, 2017
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Patent Title: Chip package structure Sep. 06, 2016
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Patent Title: Chip package structure and manufacturing method thereof Sep. 06, 2016
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Patent Title: Quad flat no-lead package and manufacturing method thereof Jul. 26, 2016
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Patent Title: Flat no-lead package and the manufacturing method thereof Apr. 19, 2016
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Patent Title: Thermally enhanced electronic package Apr. 05, 2016
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Patent Title: Chip package structure Feb. 23, 2016
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Patent Title: Semiconductor package structure and manufacturing method thereof Nov. 24, 2015
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Patent Title: Manufacturing method for micro bump structure Nov. 17, 2015
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Patent Title: Conductive structure and method for forming the same Oct. 13, 2015
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Patent Title: Chip package structure and manufacturing method thereof Sep. 01, 2015
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Patent Title: Method for wafer level packaging and a package structure thereof Jul. 21, 2015
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Patent Title: Semiconductor package structure and manufacturing method thereof Jun. 09, 2015
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Patent Title: Method of manufacturing semiconductor packaging May. 05, 2015
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Patent Title: Chip structure and multi-chip stack package Apr. 28, 2015
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Patent Title: Manufacturing method of wafer level package Mar. 17, 2015
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Patent Title: Qfn package and manufacturing process thereof Feb. 24, 2015
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Patent Title: Method for manufacturing chip package structure Nov. 25, 2014
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Patent Title: Semiconductor structure having a silver alloy bump body and manufacturing method thereof Nov. 04, 2014
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Patent Title: Conductive structure and method for forming the same Oct. 28, 2014
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Patent Title: Wafer level package structure Sep. 16, 2014
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Patent Title: Structure of stacking chips and method for manufacturing the same Aug. 19, 2014
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Patent Title: Conductive structure and method for forming the same Jul. 22, 2014
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Patent Title: Semiconductor structure having no adjacent bumps between two adjacent pads Jul. 22, 2014
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Patent Title: Semiconductor structure and manufacturing method thereof Jul. 15, 2014
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Patent Title: Chip package structure and manufacturing method thereof Jul. 08, 2014
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Patent Title: Packaging structure May. 27, 2014
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Patent Title: Chip package structure using flexible substrate May. 13, 2014
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Patent Title: Computer implemented apparatus for generating and filtering creative proposal Apr. 29, 2014
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Patent Title: Bump structure and manufacturing method thereof Apr. 15, 2014
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Patent Title: Semiconductor package structure and manufacturing method thereof Apr. 08, 2014
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Patent Title: Chip package structure and chip packaging method Feb. 18, 2014
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Patent Title: Thermally enhanced electronic package Oct. 22, 2013
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Patent Title: Rfid real-time information system accommodated to semiconductor supply chain Oct. 08, 2013
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Patent Title: Ventilating apparatus May. 21, 2013
Federal grants, loans, and purchases
Estimated quarterly amount awarded from public contracts
Recent insights relating to IMOS
Recent picks made for IMOS stock on CNBC
ETFs with the largest estimated holdings in IMOS
- ... Highest Price Target
- ... Median Price Target
- ... Lowest Price Target
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- Is $IMOS stock a Buy, Sell, or Hold?
- What is the price target for $IMOS stock?
* Analyst consensus is not financial advice. Please see our data disclaimers .
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Shareholder
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- Who owns $IMOS stock?
- Who owns the most shares of $IMOS stock?
- What funds own $IMOS stock?
* These are estimates based on data taken from SEC filings. There may be inaccuracies due to parsing errors, accidental double-counting, incorrect classification of indirectly owned shares, or any other number of issues.
The Quiver Smart Score combines our data on Congress Trading, Lobbying, Insider Trading, CNBC Mentions and more to provide a comprehensive view of the strength of a stock's underlying data.
The Smart Score grades stocks on a scale of 1 (weakest) to 10 (strongest) based on the strength of the underlying data.Sign Up to view IMOS Smart Score
See concise summaries of analyst reports, presenting both bullish and bearish arguments for a stock.
Example:
The Bulls Say summary highlights positive aspects of the stock.
The Bears Say summary points out potential risks and negative aspects of the stock.